Signal processing for segmented thin-film acoustic imaging systems for portable electronic devices
US12039800B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 30, 2022 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Sep 20, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/70
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.