Connect structure for semiconductor processing equipment
US12040163B2 · kind B2 · utility
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6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2022 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Sep 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3288
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. The housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. An annular bead is connected to the first annular sidewall to flexibly deform the deformable pipe toward the non-deformable pipe structure when the first thread structure rotatably engages a second thread structure of the non-deformable pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.