Electronic devices and methods of manufacturing electronic devices
US12040277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2021 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Jun 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0085
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one example, an electronic device includes a substrate with a substrate front side, a substrate rear side opposite to the substrate front side, a substrate body, and conductive vias extending through the substrate body from the substrate front side to the substrate rear side. A first construct is over the substrate front side and includes a first dielectric structure and first conductors embedded in the first dielectric structure and coupled to the conductive vias. A second construct is over the substrate rear side and includes a second dielectric structure and second conductors embedded in the second dielectric structure and coupled to the conductive vias. One or more of the first conductors or the second conductors define one or more passive devices. Other examples and related methods are also disclosed herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.