Manufacturing process of light emitting device comprising quantum dot film and transparent adhesive layer

US12040426B2 · kind B2 · utility

Assignee

• Najing Technology Corporation LTD. · CN

Inventors

• Yongyin KANG · Zhejiang, CN
• Xiangpeng Du · Zhejiang, CN
• Hailin Wang · Zhejiang, CN
• Jianhai Zhou · Zhejiang, CN
• Yunjian Lan · Zhejiang, CN

Key dates

• Filing date: Sep 20, 2019
• Grant date: Jul 16, 2024
• Expiry date: Jul 17, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8583

Abstract

This present disclosure provides a manufacturing process of light emitting device and a light emitting device. The manufacturing process of light emitting device includes: step S1, making a quantum dot film; step S2, providing a LED unit, the LED unit including at least one LED chip; step S3, disposing a first transparent adhesive layer on an exposed surface of each LED chip; step S4, disposing the quantum dot film on the surface of the first transparent adhesive layer far away from the LED chip.