Component carrier with low-solvent fiber-free dielectric layer
US12041730B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Sep 2, 2021 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Sep 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a component carrier is described. The method includes forming a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and reducing an amount of solvent in a fiber-free dielectric layer, which is directly connected to a metal layer, so that the dielectric layer with reduced amount of solvent remains at least partially uncured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.