Heat sink that varies in height
US12041754B1 · kind B1 · utility
0Cited by
3References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 6, 2022 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Jan 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink for cooling computing devices such as in a data center is disclosed. The heat sink includes a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side. The plurality of fin stages have a height that increases from the intake side to the exhaust side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.