Grinding wheel cutting apparatus and cutting method
US12042897B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 30, 2020 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Jul 27, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B51/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides a grinding wheel cutting apparatus comprising a first laser distance sensor, a master controller and a grinding wheel. The first laser distance sensor is communicatively coupled to the master controller. The laser distance sensor is configured to obtain an outer diameter of a rod workpiece. The master controller is configured to determine a segment length of a segment to be cut from the rod workpiece based on the outer diameter, a material density of the rod workpiece and a preset segment weight. The master controller is configured to perform a control to circularly cut the rod workpiece with the grinding wheel according to the segment length. The present disclosure further relates to a cutting method using the grinding wheel cutting apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.