Manufacturing method of electronic device
US12043011B2 · kind B2 · utility
0Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2021 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Dec 25, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.