Method of centering probe head in mounting frame
US12044704B2 · kind B2 · utility
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1References
4Claims
0Family size
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Key dates
| Filing date | Feb 28, 2022 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Mar 3, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.