Heat dissipation structure
US12045103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2023 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Mar 25, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure includes a heat dissipation member and a fixed member. The fixed member has a first surface and a second surface oppositely. The heat dissipation member is disposed on the first surface, and one part of the second surface corresponds to one side of at least one heat generating source and is disposed adjacent to the one side of the heat generating source. The first surface has a first zone surrounded by a second zone. The heat dissipation member is disposed on the first zone corresponding to the heat generating source. The second zone has at least one groove arranged around one part of the first zone. A distance between one side of the groove adjacent to the first zone and the first zone is less than 1.0 mm, and a volume ratio of the groove to the heat dissipation member is 0.9 to 1.6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.