Device of mass transferring chips
US12046496B2 · kind B2 · utility
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7Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 22, 2021 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Sep 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.