Patent · US Active

Semiconductor component arrangement, method for fabrication thereof and heat dissipation device

US12046531B2 · kind B2 · utility

0Cited by

8References

12Claims

0Family size

Assignee

VITESCO TECHNOLOGIES GMBH · DE

Inventors

Detlev Bagung · Bernhardswald, DE
Christina Quest-Matt · Munich, DE
Thomas Riepl · Bad Abbach, DE
Daniela Wolf · Munich, DE

Key dates

Filing date	Oct 8, 2019
Grant date	Jul 23, 2024
Priority date	—
Expiry date	May 19, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10166
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.