Ultrasonic horn and manufacturing apparatus of semiconductor device
US12046574B2 · kind B2 · utility
0Cited by
0References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2021 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Dec 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/78353
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An ultrasonic horn (50) includes: a vibration source part (53) to which an ultrasonic vibrator (58) is mounted; a tip end part (56) to which a capillary (18) is mounted; and an intermediate part (54) which is interposed between the tip end part (56) and the vibration source part (53) and propagates vibration generated by the ultrasonic vibrator (58) to the tip end part (56). The intermediate part (54) is formed with a single spiral hole (68) which is a hole penetrating in a radial direction of the ultrasonic horn (50) and advances in an axial direction as the spiral hole advances in a circumferential direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.