Semiconductor module
US12046584B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2022 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Jul 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49175
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A half bridge power module (1) comprising a substrate (2) comprising an inner load track (11), two intermediate load tracks (12, 14) and two outer load tracks (10,13), wherein an external terminal is mounted on one of the intermediate load tracks (12, 14), an external terminal (3, 4) is mounted on one of the outer load tracks (10, 13) and an external terminal (5) is mounted on the inner load track (11); wherein semiconductor switches (101, 12, 105, 106) are mounted on the outer load tracks (10, 13) and are electrically connected to the intermediate load track (12); and semiconductor switches (103, 104, 107, 108) are mounted on the intermediate load tracks (12, 14) and are electrically connected to the inner load track (11).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.