Ferroelectric film phase shifter and wafer-level phased array chip system
US12046789B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2024 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Apr 28, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P11/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A ferroelectric film phase shifter includes a substrate layer; an isolated signal layer located on the substrate layer; first, second and third top transmission line electrodes distributed on the isolated signal layer at intervals; the first and second top transmission line electrodes located at both ends of the isolated signal layer, and the third top transmission line electrode located on a middle region of the isolated signal layer; a bottom transmission line electrode located in the isolated signal layer; an intermediate transmission line structure located in a middle region of the bottom transmission line electrode and adjacent to the third top transmission line electrode; MIM hafnium oxide-based ferroelectric capacitor structures located at two ends of the bottom transmission line electrode; and metal transmission line structures located between each MIM hafnium oxide-based ferroelectric capacitor structure and each of the first top transmission line electrode and the second top transmission line electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.