Multilayer board
US12046838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2022 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Jan 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An element assembly has a structure in which insulator layers including first and second insulator layers are laminated in an up-down direction. The first insulator layer is above the second insulator layer. A radiant conductor layer is on an upper surface of the first insulator layer. A first capacitance defining portion includes a first interlayer connection conductor passing through one or more of the insulator layers in the up-down direction. The first interlayer connection conductor is electrically connected to the radiant conductor layer. The radiant conductor layer, a ground conductor, and the first capacitance defining portion define and function as a patch antenna. When the first interlayer connection conductor is electrically connected to the radiant conductor layer, a distance from a lower end of the first interlayer connection conductor to the ground conductor in the up-down direction is shorter than a distance from the radiant conductor layer to the ground conductor in the up-down direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.