Surface acoustic wave resonator with multi-layer piezoelectric substrate with heat dissipation
US12047053B2 · kind B2 · utility
4Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2021 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Dec 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6413
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Aspects of this disclosure relate to a surface acoustic wave resonator having a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. Related surface acoustic wave filters, radio frequency modules, and wireless communication devices are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.