Electronic device including circuit board placed adjacent to frame made of conductive material
US12047522B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2022 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Jul 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/243
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic device is provided. The electronic device includes a first mechanical element, a second mechanical element moving with respect to the first mechanical element, a frame including a first frame formed of a conductive material and coupled to the first mechanical element and a second frame formed of a conductive material and coupled to the second mechanical element, a segmentation part formed at the frame to segment each of the first frame and the second frame into a plurality of parts, and a first substrate member which includes a first part and a second part spaced apart from each other, and a first bending part for bendably connecting the first part and the second part and is disposed to move together with at least one of the first mechanical element and the second mechanical element, wherein a plurality of wires arranged at the first substrate member may be arranged not to pass through a first area which is an area of the first bending part of the first substrate member and is adjacent to the segmentation part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.