Extreme environment capable multilaminar transductive biomorph device
US12048247B1 · kind B1 · utility
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4References
5Claims
0Family size
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Key dates
| Filing date | Jan 11, 2021 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Jul 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/877
Abstract
A wire-free multilayer biomorph device is provided where the layers are bonded without use of adhesive. The device includes a plurality of stacked perforated metal plates with interposed transductive assembly layers. The perforated metal plates and transductive assembly layers are bonded by a conductive metal ink that is subject to a thermal cycle process. Electrical connection of the perforated metal plates and transductive assembly are realized through structural connectors thru-connectors thereby obviating the need for wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.