Methods of fabricating implantable devices
US12048845B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 25, 2022 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Jul 15, 2042 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3758
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Implantable devices are provided herein, along with methods of fabricated such implantable devices. An exemplary method of fabricating an implantable device includes coupling electronics to a conductive via at a first side of a first glass substrate. The conductive via extends from the first side through the first glass substrate to a second side of the first glass substrate. The method further includes attaching a second glass substrate to cap the first side of the first glass substrate and form a hermetically sealed chamber containing the electronics, rounding edges of the implantable device after attaching the cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.