Lamination device
US12049067B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2022 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Oct 21, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/202
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lamination device includes a first jig to which is fixed a window that includes a flat surface and at least one curved surface, a pressure pad disposed on a second jig that faces the first jig, where the pressure pad includes a first surface that corresponds the flat surface of the window and a second surface that corresponds the at least one curved surface of the window, and a pressure sensor array disposed on the pressure pad. The pressure sensor array includes a plurality of first electrodes that overlap the first surface and a plurality of second electrodes that overlap the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.