Heat-resistant semi-conductive thermoplastic resin composition
US12049560B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Feb 25, 2021 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Feb 25, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present application relates to a heat-resistant semi-conductive thermoplastic resin composition and shaped articles made therefrom. The thermoplastic resin composition comprises the following components: an aromatic polycarbonate, a polyalkylene terephthalate, a conductive carbon black and a reinforcement material. The shaped article made from the thermoplastic resin composition according to the present invention has a good combination of heat-resistance, semi-conductivity and dimensional stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.