Adhesive joining device and adhesive joining method for a metal surface
US12049708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2019 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | May 24, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B5/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive joining device for providing a connection between a metal surface and a body using an electrochemical etching device. The device has a vacuum holder to form a vacuum connection between the adhesive joining device and the metal surface. A tool changing holder receives at least two different tools in a time-staggered manner. A first tool can be an electrochemical etching cell for an electrolyte with an etching chamber which is oriented towards the metal surface, a feed for electrolyte, a drain, and two electrodes, one electrode being mechanically and electrically connected to the metal surface and the second electrode coming into contact with the electrolyte. A second tool is for holding and positioning the body to be adhered to the etched metal surface. The distance, position, alignment, and/or parallelity of the body to be adhered can be configured in a reliable and defined manner for the adhesion process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.