Patent · US Active

Adhesive joining device and adhesive joining method for a metal surface

US12049708B2 · kind B2 · utility

0Cited by
7References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 17, 2019
Grant dateJul 30, 2024
Priority date
Expiry dateMay 24, 2041

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF16B5/08
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An adhesive joining device for providing a connection between a metal surface and a body using an electrochemical etching device. The device has a vacuum holder to form a vacuum connection between the adhesive joining device and the metal surface. A tool changing holder receives at least two different tools in a time-staggered manner. A first tool can be an electrochemical etching cell for an electrolyte with an etching chamber which is oriented towards the metal surface, a feed for electrolyte, a drain, and two electrodes, one electrode being mechanically and electrically connected to the metal surface and the second electrode coming into contact with the electrolyte. A second tool is for holding and positioning the body to be adhered to the etched metal surface. The distance, position, alignment, and/or parallelity of the body to be adhered can be configured in a reliable and defined manner for the adhesion process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.