Shrouded powder patch
US12050061B2 · kind B2 · utility
1Cited by
9References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2021 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Apr 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20309
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink for use in an immersion cooling system that includes a sintered powder structure enclosed in a porous enclosure. The porous enclosure has openings, e.g., formed by a mesh, with a size to help contain sintered powder particles that may be dislodged during operation of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.