Thermocouple wafer calibration system and calibration method using the same
US12050140B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2022 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Mar 6, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/023
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure relates to a thermocouple wafer calibration system including: a main body portion composed of a chamber forming a sealed space, and a support installed a lower edge of the chamber and supporting the chamber to be spaced apart from the ground; a thermocouple wafer composed of a plate installed to be horizontal inside the sealed space of the chamber, and a first thermocouple unit attached to a upper surface of the plate so as to form a plurality of first measurement contact points; a calibration portion provided with a second thermocouple unit penetrating the chamber in a space where the chamber spaced from the ground, then partially accommodated inside the sealed space, and calibrated to form a plurality of second measurement contact points in contact with a lower surface of the plate at a position corresponding to each of the first measurement contact points; a temperature measurement portion partially accommodated inside the sealed space of the chamber and measuring a temperature of the sealed space; a heating portion accommodated inside the sealed space of the chamber, allowing thermogenesis and being in thermal contact with the second thermocouple unit dir…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.