Heat dissipatable die unit and probe seat using the same
US12050235B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2022 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Jan 20, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07371
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.