Touchpad module and computing device using same
US12050741B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2023 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Mar 8, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/016
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touchpad module for a computing device is provided. A fixing frame is concavely formed in a casing of the computing device. The fixing frame includes a supporting part. The touchpad module is installed within the fixing frame. The touchpad module includes a touch member and a pressure sensing element. The touch member includes a covering plate and a circuit board. An edge part of covering plate is supported on the supporting part. The pressure sensing element is installed on the touch member and electrically connected with the circuit board. While the touch member is pressed, the touch member is bent downwardly. Consequently, the touch member has a deformation amount. According to the deformation amount, a magnitude of a pressing force exerted on the touch member is sensed, and a pressure sensing signal is generated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.