Inlay for electronic document, method for producing an electronic document comprising such an inlay, and electronic document obtained
US12050955B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2023 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Jun 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/49
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Inlay (40) comprising a substrate (41) and a first zigzag portion (42) formed of a metal wire (421) embedded in an upper face (43) of the substrate (41), the first zigzag portion (42) comprising, alternately, rectilinear segments (422) and bends (423), at least one of the rectilinear segments (422) of the first zigzag portion (42) being disposed, at least in part, in a zone (45) of the upper face (43) of the substrate (41) configured to form a spotface of a cavity of an electronic document, and the inlay (40) comprising a connection wire (47) configured to join together at least the rectilinear segments (422) of the first zigzag portion (42). Method for producing an electronic document (1) comprising such an inlay (40), and electronic document (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.