Material processing apparatus and operating method thereof
US12051600B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Mar 16, 2021 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Sep 7, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01J3/04
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A material processing apparatus including a processing chamber, an external pressure source, a pressure reducer, a temperature regulator, and a controller is provided. The processing chamber has an internal space. The external pressure source is connected to the processing chamber to pressurize the internal space. The pressure reducer is connected to the processing chamber to depressurize the internal space. The temperature regulator is arranged in the processing chamber to adjust the temperature in the internal space. The controller is configured to control the external pressure source and the temperature regulator to respectively increase the temperature to a first predetermined temperature and the pressure to a first predetermined pressure, and to control the pressure in the processing chamber to rise continuously before the temperature in the processing chamber rises to the first predetermined temperature. An operating method of a material processing apparatus is further provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.