High throughput microprinting process
US12051612B2 · kind B2 · utility
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1References
22Claims
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Assignee
Inventor
Key dates
| Filing date | Jun 18, 2020 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Aug 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments disclose methods of transferring selected microdevices on a receiver substrate. In one embodiment, a high resolution display comprising a light emitting device (LED) array may be provided to assist in transferring the microdevices. The LED array can selectively either release a layer by using light or cure a bonding layer. The pixels in the display can be turned on corresponding to a set of selected microdevices with predefined intensities to release the set of selected microdevices from the donor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.