Direct to chip application of boiling enhancement coating
US12051637B1 · kind B1 · utility
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2References
24Claims
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Key dates
| Filing date | Sep 1, 2023 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Sep 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3736
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.