Smart ring and methods for manufacturing
US12052816B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2021 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | May 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a smart ring includes receiving a printed circuit board having a processor, a memory, a temperature sensor, a wireless transceiver and a perturbation sensor, receiving a power source with a first radius of curvature within a range of 7 mm to 15 mm, coupling the printed circuit board and the power source together to form a first assembly with the first radius of curvature, encapsulating the first assembly to form a second assembly with a second radius of curvature wherein the first radius is larger than the second radius, and wherein the second assembly includes a plurality of physical anchors, determining a first ring size from a plurality of ring sizes, and coupling a band to the second assembly via the plurality of physical anchors to form an enclosed circle-like shape in response to the first ring size, wherein the band is characterized by the second radius.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.