Connection pad and substrate
US12052820B2 · kind B2 · utility
0Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2020 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Aug 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a connection pad and a substrate, and belongs to the field of display technology. The connection pad of the present disclosure includes a plurality of sub-pads and a first connection portion, wherein the plurality of sub-pads are spaced apart from each other and electrically connected through the first connecting portion. The connection pads in the embodiment of the present disclosure are formed by connecting the sub-pads through the first connection portion, that is, a certain gap exists between the sub-pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.