Method and process for creating high-performance coax sockets
US12052830B2 · kind B2 · utility
0Cited by
24References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2021 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Dec 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a novel method of constructing a coax spring-pin socket that furnishes better performance and is easier to manufacture in volume using common dielectrics and copper plating. This is accomplished by, in application, a lamination of PCB dielectric layers. This dielectric block is then drilled, plated, etched, and drilled in steps for the construction of a coaxial structure for the signal pins, and a ground structure for ground pins. This design process that can be quickly adjusted and customized for each design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.