Aligned multi-rail high-power cooling module
US12052847B2 · kind B2 · utility
0Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2021 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Nov 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20636
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system includes a pair of chassis, a housing, and a cooling module. Each chassis including multiple rails with adjacent rails defining card slots. The housing connected to the chassis in first card slots on the pair of chassis and formed to contain electronic components including a heat generating component. The cooling module connected to the chassis in second card slots on the pair of chassis and formed to contact the heat generating component through an aperture in the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.