Semiconductor module and method for producing same
US12052878B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2021 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Dec 21, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor module has a layer structure and at least one capacitive sensor. The layer structure is formed with an upper electrode layer, a lower electrode layer, and an active layer arranged between the electrode layers. The active layer is made of a semiconductor material. The capacitive sensor has a measuring electrode which is integrated into the layer structure. There is also described a device which has such a semiconductor module and a method for producing such a semiconductor module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.