Layer-based defect detection using normalized sensor data
US12053841B2 · kind B2 · utility
1Cited by
6References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 14, 2021 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Sep 19, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The disclosed embodiments relate to the monitoring and control of additive manufacturing. In particular, a method is shown for removing errors inherent in thermal measurement equipment so that the presence of errors in a product build operation can be identified and acted upon with greater precision. Instead of monitoring a grid of discrete locations on the build plane with a temperature sensor, the intensity, duration and in some cases position of each scan is recorded in order to characterize one or more build operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.