Methods for enhancing the bonding strength of thermoset adhesives and sealants via disulfide dynamic chemistry
US12054651B2 · kind B2 · utility
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Key dates
| Filing date | Mar 20, 2023 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Mar 20, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.