Two-component solvent-less adhesive composition
US12054652B2 · kind B2 · utility
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11References
12Claims
0Family size
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Key dates
| Filing date | Mar 4, 2020 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Jun 9, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J175/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component and (B) a polyol component containing a poly-ester-amide polycarbonate polyol. The present disclosure also provides a method of forming a two-component solvent-less adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.