Vacuum deposition facility and method for coating a substrate
US12054821B2 · kind B2 · utility
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33Claims
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Key dates
| Filing date | Dec 11, 2018 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Nov 16, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vacuum deposition facility for continuously depositing, on a running substrate, coatings formed from metal or metal alloy, the facility including—a vacuum chamber and a device for running the substrate through the vacuum chamber along a given path, wherein the vacuum chamber further includes:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.