Patent · US Active

Apparatus and method for bonding tie layers on reinforced thermosetting resin laminates for use in welding thermoset composite pipe joints

US12055253B2 · kind B2 · utility

1Cited by
40References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 14, 2021
Grant dateAug 6, 2024
Priority date
Expiry dateAug 17, 2042

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF16L47/16
  • WIPO fieldMechanical elements
  • WIPO sectorMechanical engineering

Abstract

A system and method for coupling pipes includes a first pipe having a tapered, spigot end; and a second pipe having a tapered, socket end adapted to internally receive the tapered, spigot end of the first pipe. The first pipe and the second pipe are made from a reinforced thermosetting resin (RTR) material. A thermal joining process is used to bond a thermoplastic material onto the RTR material of the first pipe, the second pipe, or both pipes. Upon application of thermal heating to the first and second pipes, the heat between the first pipe and the second pipe is sufficient to melt the thermoplastic material such that, when the heat is removed, the hardened thermoplastic material seals the first pipe to the second pipe. A system and a method of coupling the first pipe and the second pipe may include the coupler made of RTR material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.