Scanning radar system with substrate integrated waveguides and heat dissipating structures
US12055654B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2021 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Jul 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0024
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radar system is described herein. The radar system includes a printed circuit board (PCB) that includes a metallized top layer and a substrate layer that is adjacent the metallized top layer. The substrate layer includes a substrate integrated waveguide (SIW), and the metallized layer has a slotted taper etched therein. The slotted taper is positioned relative to the SIW such that an electromagnetic signal generated by a monolithic microwave integrated circuit (MMIC) passes from the slotted taper to the SIW without an intervening microstrip line. The radar system further includes a housing that acts both to disperse heat and to suppress undesired electromagnetic radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.