Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter and CMOS image sensor
US12055851B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 28, 2021 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Jul 19, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/20
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer produced using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a core represented by Chemical Formula 1; and a shell surrounding the core, the shell being represented by Chemical Formula 2:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.