Patent · US Active

Method for offset measure compensation

US12055911B2 · kind B2 · utility

0Cited by

7References

8Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Simon Ockenfuss · Eppelheim, DE
Harald Mathias · Brackenheim, DE

Key dates

Filing date	Mar 31, 2020
Grant date	Aug 6, 2024
Priority date	—
Expiry date	Feb 24, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG05B2219/49235
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for recognition and compensation of an offset measure between stamping coordinates of a stamping device and laser coordinates of a laser device in a combined stamping-laser machine for processing a plate-shaped workpiece, particularly a metal sheet, includes introducing a structure into the plate-shaped workpiece by respectively using the stamping device or the laser device. A measurement variable of the introduced structure is determined respectively by the laser device or the stamping device. The measurement variable is compared with an expected variable, and a deviation of the measurement variable from the expected variable corresponds to an offset measure. The offset measure is balanced with the coordinates of the laser device in the laser coordinate system or with the coordinates of the stamping device in the stamping coordinate system in order to compensate for the offset measure between the stamping coordinates and the laser coordinates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.