System and method for thermal management of multi-enclosure system
US12055987B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 18, 2022 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Apr 25, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2201/81
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for thermal management are disclosed. The thermal management method and systems may reduce the likelihood of a data processing system exceeding thermal limits even in cases of highly customizable and modifiable data processing system. To reduce the likelihood of the data processing system failing to meet thermal limits, the data processing system may implement a distributed thermal management system. The distributed thermal management system may include multiple components that are responsible for granular and/or global thermal management of the data processing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.