Multilayered electronic component
US12057271B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Jun 15, 2022 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Oct 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer interposed therebetween in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein 0.46 to 1.08 at % is a range of an indium (In) content compared to nickel (Ni) and indium (In) contents in a surface layer portion of the internal electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.