Patent · US Active

Deposition system with integrated cooling on a rotating drum

US12057297B2 · kind B2 · utility

0Cited by
10References
26Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 18, 2020
Grant dateAug 6, 2024
Priority date
Expiry dateMar 18, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/3321
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

In one aspect, a system for depositing a film on a substrate is disclosed, which comprises at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive species. The system further includes an inner cooling cylinder and a substrate cylinder, where the inner cooling cylinder is fixedly positioned relative to the substrate cylinder, and the substrate cylinder at least partially surrounds the inner cooling cylinder. At least one mount is coupled to the substrate cylinder for mounting one or more substrates to the substrate cylinder.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.