Wiring substrate and semiconductor device
US12057384B2 · kind B2 · utility
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2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2021 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Jun 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a bendable portion including one or more wiring layers and insulation layers that are alternately stacked. The insulation layers of the bendable portion include a first insulation layer and a second insulation layer. The first insulation layer is located at an inner bent position of the bendable portion when the bendable portion is bent. The second insulation layer is located at an outer bent position of the bendable portion relative to the first insulation layer when the bendable portion is bent. The first insulation layer has a higher elastic modulus than the second insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.