Semiconductor device
US12057404B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2021 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Feb 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes pads of a first group and a plurality of first peripheral pads, which are adjacent to each other and spaced apart by a first horizontal gap in a first direction, and pads of a first group and a plurality of first peripheral pads, which are connected to each other and spaced apart by a first vertical gap, greater than the first horizontal gap, in a second direction. A plurality of first wiring patterns include first horizontal extension portions extending at an angle exceeding about 45 degrees with respect to the first direction within the first horizontal gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.