Package comprising an integrated device configured for shareable power resource
US12057436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2023 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Aug 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06548
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package that includes a substrate and integrated device coupled to the substrate. The integrated device includes a first core and a second core. The substrate includes a first power interconnect configured to provide a first electrical path for a first power resource to the first core of the integrated device. The first power interconnect includes a first power plane. The substrate includes a second power interconnect configured to provide a second electrical path for a second power resource to the second core of the integrated device. The second power interconnect includes a second power plane. The substrate includes a switch coupled to the first power interconnect and the second power interconnect, where if the switch is turned on, the switch is configured to enable at least some of the power resource from the second power resource to contribute to the first core of the integrated device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.